PA66 Mold Release

EAR210

mold-release optimized PA66 compound for smoother demolding and stable injection molding. The recorded profile for this grade lists specific gravity 1.13, tensile stress 90 MPa, and HDT 65 degrees C. Confirm final suitability against the molded part and processing conditions.

Document Support
TDSSDSCOAREACHRoHS

REACH / RoHS support available upon request.

Grade Snapshot

Review the reference values before confirming this material for a molded part or document request.

Specific gravity
1.13
ISO 1183
Tensile stress
90 MPa
ISO 527
HDT 1.8 MPa
65 °C
ISO 75
Flammability
V-2 Class
UL 94, 0.8 mm

Core Selection Data

Reference Values for Early Screening

PropertyValueUnitTest Method
Specific gravity1.13ISO 1183
Tensile stress90MPaISO 527
Tensile modulus2900MPaISO 527
Flexural modulus2900MPaISO 178
Charpy impact strength(Notched) @ 23 °C4kJ/m2ISO 179/1eA
Heat deflection temperature (1.8 MPa)65°CISO 75

Core comparison values are shown here. Full property, processing, impact, electrical, and project-specific data are provided through TDS or project review.

Request Full TDS

Grade Characteristics

  • PA66 Mold Release compound direction
  • Modified compound direction for project review
  • V-2 flammability reference
  • Final selection should be confirmed against part design and molding conditions

Typical Applications

  • Thin-wall molded parts
  • complex geometry components and applications requiring smooth demolding.

Material Evaluation Notes

This grade page is for preliminary material selection. For project evaluation, please confirm the application, processing method, mold development stage, cavity count, target dimensional requirement, target performance requirements, current reference grade, document requirements, and estimated volume.

Inquiry Preparation

Prepare a Grade Evaluation

Send the application, key performance requirements, mold stage, cavity count, dimensional concern, current material or reference grade, document needs, and estimated volume. These inputs identify the next grade, document, and sample steps for the project.