PA66 Mold Release

EAR210

mold-release optimized PA66 compound for smoother demolding and stable injection molding. The recorded profile for this grade lists specific gravity 1.13, tensile stress 90 MPa, and HDT 65 degrees C.

Document Support
TDS

SDS, COA, REACH and RoHS documents are available on request, confirmed by grade and project.

Grade Snapshot

Catalog values and test methods for this grade.

Specific gravity
1.13
ISO 1183
Tensile stress
90 MPa
ISO 527
HDT 1.8 MPa
65 °C
ISO 75
Flammability
V-2 Class
UL 94, 0.8 mm

Core Selection Data

Reference Values for Early Screening

PropertyValueUnitTest Method
Specific gravity1.13ISO 1183
Tensile stress90MPaISO 527
Tensile modulus2900MPaISO 527
Flexural modulus2900MPaISO 178
Charpy impact strength(Notched) @ 23 °C4kJ/m2ISO 179/1eA
Heat deflection temperature (1.8 MPa)65°CISO 75

Core comparison values are shown here. Full property, processing, impact, electrical, and project-specific data are provided through TDS or project review.

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Grade Characteristics

  • PA66 Mold Release formulation
  • Modified formulation for the listed part requirements
  • V-2 flammability reference

Typical Applications

  • Thin-wall molded parts
  • complex geometry components and applications requiring smooth demolding.

Material Evaluation Notes

Use these reference values for preliminary screening only. Confirm final suitability with current technical documents, molded-part trials, processing conditions, and project-specific requirements.

Inquiry Preparation

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Send the application, key performance requirements, mold stage, cavity count, dimensional concern, current material or reference grade, document needs, and estimated volume. These inputs identify the next grade, document, and sample steps for the project.