Carbon Fiber Reinforced POM Compound

ECF300

30% carbon-fiber reinforced POM for molded parts requiring high stiffness, low shrinkage, and stable conductive performance. The recorded profile for this grade lists MFI 4.5 g/10 min, tensile strength 95 MPa, and HDT 160 degrees C. Confirm final suitability against the molded part and processing conditions.

Document Support
TDSSDSCOAREACHRoHS

REACH / RoHS support available upon request.

Grade Snapshot

Check the core values and review sections before confirming this material for a molded part.

MFI
4.5 g/10 min
Flow index
Tensile
95 MPa
ISO 527
HDT
160 °C
ISO 75-2, 1.8 MPa
Color
Black
Available color

Core Selection Data

Reference Values for Early Screening

PropertyValueUnitTest Method
Density1.43g/cm3ISO 1183
Melt Flow Rate (MFI)4.5g/10 minISO 1133, 195 °C/2.16 kg
Molding Shrinkage0.8-0.9%Internal Method
Tensile Strength95MPaISO 527
Flexural Modulus7000MPaISO 178
Charpy Notched Impact Strength5kJ/m2ISO 179/1eA
Heat Deflection Temperature160°CISO 75-2, 1.8 MPa

Suggested maximum moisture for POM processing: 0.2-0.4 %

Core comparison values are shown here. Full property, processing, impact, electrical, and project-specific data are provided through TDS or project review.

Request Full TDS

Key Features

  • 30% Carbon Fiber Content
  • High Stiffness
  • Conductive Black Grade

Typical Applications

  • Automotive Functional Parts
  • Electrical and Electronic Components
  • Industrial Molded Parts

Material Evaluation Notes

This product page is for preliminary material selection. For project evaluation, please confirm the application, processing method, mold development stage, cavity count, target shrinkage or dimensional requirement, target performance requirements, current reference grade, document requirements, and estimated volume.

Inquiry Preparation

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Send the application, key performance requirements, mold stage, cavity count, shrinkage or warpage concern, current material or reference grade, document needs, and estimated volume. These inputs identify the next grade, document, and sample steps for the project.